Penggayaan APA
Characterization of Integrated Circuit Packaging Materials. (2010).
New York:
Momentum Press.
Chicago Style
Characterization of Integrated Circuit Packaging Materials.
.
New York:
Momentum Press,
2010.
Text.
MLA Style
Characterization of Integrated Circuit Packaging Materials.
.
New York:
Momentum Press,
2010.
Text.
Turabian Style
Characterization of Integrated Circuit Packaging Materials.
New York:
Momentum Press,
2010.
Print.