E Book

Force Sensors for Microelectronic Packaging Applications

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Sensor Design -- Measurement System -- Characterization -- Applications -- Conclusions and Outlook.This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

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Ketersediaan

Informasi Detail

Judul Seri

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No. Panggil

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Penerbit

Berlin : Springer., 2005

Deskripsi Fisik

VIII, 178 p.online resource.

Bahasa

English

ISBN/ISSN

9783540269458

Klasifikasi

620.115

Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

1st ed.

Subjek

Quality control.
Reliability.
Industrial safety.
Quality Control, Reliability, Safety and Risk.
Engineering.
Engineering, general.
Electronics.
Microelectronics.
Electronics and Microelectronics, Instrumentation.
Nanotechnology.
Optical materials.
Electronic materials.
Optical and Electronic Materials.

Info Detail Spesifik

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Pernyataan Tanggungjawab

Jürg Schwizer, Michael Mayer, Oliver Brand.

Versi lain/terkait

Lampiran Berkas

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