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Hal. Akhir
Ambient Intelligence
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b138670
Force Sensors for Microelectronic Packaging Applications
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b138345
Electroceramic-Based MEMS
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b101200
CCD Image Sensors in Deep-Ultraviolet
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b139047
VLSI-Design of Non-Volatile Memories
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b137712
Transaction-Level Modeling with SystemC
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b137175
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/1-4020-3013-4
Magnetic Microscopy of Nanostructures
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b137837
Integrated Chemical Microsensor Systems in CMOS Technology
Judul Seri :
No. Panggil :
Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/b138987
Nanostructured and Advanced Materials for Applications in Sensor, Optoelectronic and Photovoltaic Technology
Judul Seri :
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Ketersediaan : E Book
Eksemplar : https://doi.org/10.1007/1-4020-3562-4
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